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@Alekh : Based on the comparison here, I feel EVO is a better buy.

 

1. This pic , the EVO has no gaps between the copper tubes, hence will provide more a even heat dissipation surface.

2. This pic speaks for itself.

 

Retention mechanism of EVO is good enough, right? Considering that CPU cabinet will hardly ever be moved.

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@Alekh : Based on the comparison here, I feel EVO is a better buy.

 

1. This pic , the EVO has no gaps between the copper tubes, hence will provide more a even heat dissipation surface.

2. This pic speaks for itself.

 

Retention mechanism of EVO is good enough, right? Considering that CPU will hardly ever be moved.

 

Not to cast aspersions but user hands-on prove that the T4 is a performer in its own right and can hold its own against the Hyper 212+ / EVO. More on the same

The Hyper 212 Evo is the same thing as the Plus, just with a slightly different base design.

 

[CM] New Tower CPU Cooler Hyper T4 @overclock.net.

 

Also same thread contained this --

I beta'd it as well. It's a surprisingly good heatsink and, unlike my Hyper 212+, it was dead quiet. At stock speeds, it was ~4C off from my Thermalright Archon under load.

 

That said, if you do get it, you will curse the idiot who designed the mounting mechanism. I've dealt with hard to mount heatsinks before, but this one frustrated me to no end. You're going to want to mount it outside the case with nothing else installed yet.

Now I am completely confused.

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Look Alpha, the serious concern is that my CPU has started entering the high 60s under load. It always remained in the high 50s until like a month ago. Probably need to clean out the fans and dust filters. But still, it'd be a good investment of ~2k if I go for the EVO so that even with not so good airflow (wiring in my cabinet is a mess), I'd not be risking my CPU every day.

 

That said, my GPU has started to climb up into the 80s now. Tomorrow I'll clean out my cabinet and in the process try to adjust the wires. Also, will measure to ensure the HSF I order does fit.

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Look Alpha, the serious concern is that my CPU has started entering the high 60s under load. It always remained in the high 50s until like a month ago. Probably need to clean out the fans and dust filters. But still, it'd be a good investment of ~2k if I go for the EVO so that even with not so good airflow (wiring in my cabinet is a mess), I'd not be risking my CPU every day.

 

That said, my GPU has started to climb up into the 80s now. Tomorrow I'll clean out my cabinet and in the process try to adjust the wires. Also, will measure to ensure the HSF I order does fit.

 

Clean the CPU Heat Sink Fan package thoroughly.

 

You go for the EVO but as I said the performance of the Hyper T4 and 212+ / EVO is very close in-fact to cast aspersions on the review link you posted because every where else the two towers are tied at the hip ~4° of difference give-take is not decisive enough for anyone.

 

Also because there are no more reviews directly / in-directly comparing the two I will reserve making any comments. Go for whichever will fit in your cabinet and you feel is more effective (bias towards the 212 EVO).

 

Now that is bad for the graphic card, do give it a good blast from a hair-dryer (make sure the air is not heated) and see how much muck is stuck inside the heat-sink fin array and fan-blades.

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Clean the CPU Heat Sink Fan package thoroughly.

 

Now that is bad for the graphic card, do give it a good blast from a hair-dryer (make sure the air is not heated) and see how much muck is stuck inside the heat-sink fin array and fan-blades.

Sure, will do that. I generally use a thin pipe (similar to watering hose, but much thinner), to blow out dust. Need to buy that today from some hardware store.

 

And what was it about the retention mechanism of EVO vs. T4 that you were mentioning? Sorry, too lazy to look up pics/vids :D , so just asking.

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@Alekh : Based on the comparison here, I feel EVO is a better buy.

1. This pic , the EVO has no gaps between the copper tubes, hence will provide more a even heat dissipation surface.

2. This pic speaks for itself.

Retention mechanism of EVO is good enough, right? Considering that CPU cabinet will hardly ever be moved.

Already went through that, got confused and hence asked here.

 

Not to cast aspersions but user hands-on prove that the T4 is a performer in its own right and can hold its own against the Hyper 212+ / EVO. More on the same

 

 

[CM] New Tower CPU Cooler Hyper T4 @overclock.net.

 

Also same thread contained this --

 

Now I am completely confused.

And now I've already ordered the T4. Delivery by 1st week of Feb. Lets see how this goes. :|

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Sure, will do that. I generally use a thin pipe (similar to watering hose, but much thinner), to blow out dust. Need to buy that today from some hardware store.

 

And what was it about the retention mechanism of EVO vs. T4 that you were mentioning? Sorry, too lazy to look up pics/vids :D , so just asking.

 

I will try to put it across better.

 

The problem with the Hyper 212 EVO's retention mechanism is not that it is loose OR flimsy OR ineffective, no the problem is that it is inefficient and if you are not careful you can have scratch marks on the CPU's metal shell HSF.

 

There was a huge uproar that the Intel Ivy-Bridge's ran hot because the bonding material used between the CPU and this metal shell was TIM and not thermal solder as is the norm but eventually it quieted down.

 

Now thanks to these multiple layers of transfer the best way for a third party tower-cooler / closed water loop etc. to function is by putting as much pressure on the CPU, this also leads to the maximum surface area contact between the CPU's physical heat-spreader and the base of the tower and from the TIM guides I should not have to repeat how air gets trapped / irregular surface contact on the whole (macro level).

 

Now the X shaped retention mechanism means that the central portion of the base is in maximum contact with the CPU area (corresponding to it) but the rest of the base does not push down on the processor shell. This allows yaw movement.

 

2cpqn9d.jpg

 

The area I have marked in red is the focal point where there is maximum pressure as you move away from that point the pressure is not so acute and doesn't follow the curvature of the CPU shell and air and other anomalies can creep in, therefore poor design (in my opinion).

 

The Hyper T4 does not suffer the same issue because it has an equal load distribution mechanism. No central pressure point, pressure is applied at the periphery and the centre is tied down so. Example --

IMG_1262.jpg.jpeg

 

Hope this gets my point across.

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Already went through that, got confused and hence asked here.

 

 

And now I've already ordered the T4. Delivery by 1st week of Feb. Lets see how this goes. :|

Click pics during installation, and let us know first hand experience. If it is good, I'll order one.

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Alright. So finally got the T4 from Flipkart ! :wOOtjumpy:

 

88Unys9.jpg

 

Contents:

 

euxMQCq.jpg

 

Old TP cleaned with IPA:

 

nvLj16W.jpg

 

Backplate (on the backside of the MB). The BP has 3 grooves, which represent the 3 different Intel socket variations this cooler can be used for. Basically you move the plastic shoes on these grooves so that it fits your MB's screw alignment:

 

OUd0Coj.jpg

 

With the backplate screwed from the top (hand-lockable screws):

 

FugLZbc.jpg

 

The Retention plates. Alignment of these depends on your processor mount:

 

OTGiUE0.jpg

 

Final locking of the HS through the Retention plates via a lever lock:

 

gP9MbvI.jpg

 

XyifO5d.jpg

 

Works awesome. Haven't done any benchmarks (and I ain't even OCed), but CoreTemp shows normal temps. Idles around 27-28 while browsing. Adobe Lightroom processing took it to a max of 40, though only momentarily. No fan noise till now.

Will update as soon as I run some games and record the temps. :cheers:

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Glad to see that you got it Alekh Sire.

 

Seems to be an easy installer to me. What do you say?

 

Any pictures of the older TX3 EVO with the damaged push-pin system?

 

Does the Hyper TX4 bundle with another set of fan mounts?

 

I see that the AMD retention system is built into the tower.

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Glad to see that you got it Alekh Sire.

 

Seems to be an easy installer to me. What do you say?

 

Any pictures of the older TX3 EVO with the damaged push-pin system?

 

Does the Hyper TX4 bundle with another set of fan mounts?

 

I see that the AMD retention system is built into the tower.

- Installation is easy as a pie after seeing the pics even for novices.

- Yeah, will send you the push pin pics. Lemme know whether they are damaged or otherwise. I just couldn't lock them FFS. This is SO. MUCH. EASIER !

- Nopes, no extra fan mounts. But fans can be snapped in on this i.e. no separate mount is needed AFAIK.

 

I can finally play Mark of the Ninja. :exoticdance: Never going for push pins again.

Thing to remember: The copper tubings are not flush with the rest of the bottom (i.e. at the contact point with the processor). So, as read in an article, I first filled in the grooves with the TP, and then applied a tiny amount on the processor's surface so that it spreads evenly (without getting wasted by going in the grooves).

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- Installation is easy as a pie after seeing the pics even for novices.

- Yeah, will send you the push pin pics. Lemme know whether they are damaged or otherwise. I just couldn't lock them FFS. This is SO. MUCH. EASIER !

- Nopes, no extra fan mounts. But fans can be snapped in on this i.e. no separate mount is needed AFAIK.

 

I can finally play Mark of the Ninja. :exoticdance: Never going for push pins again.

Thing to remember: The copper tubings are not flush with the rest of the bottom (i.e. at the contact point with the processor). So, as read in an article, I first filled in the grooves with the TP, and then applied a tiny amount on the processor's surface so that it spreads evenly (without getting wasted by going in the grooves).

 

Well good to know that installation is easy.

 

Will do that Sire.

 

Okay, grooves are built into the heat-fin array's shape?

 

The last point you raise confirms my suspicion that the Cooler Master Hyper 212+ and the T4 share a similar contact-base thanks.

 

Happy gaming, Cheerio!

 

P.S. -- Sent you STEAM friend request.

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Congrats Birdy in WYBTW and in here too.

 

Lagtha hein computer ki operation (organ transplant) success hua and I guess people can come to you without any hesitation! :tongue:

Thanks. :)

 

Well good to know that installation is easy.

 

Will do that Sire.

 

Okay, grooves are built into the heat-fin array's shape?

 

The last point you raise confirms my suspicion that the Cooler Master Hyper 212+ and the T4 share a similar contact-base thanks.

 

Happy gaming, Cheerio!

 

P.S. -- Sent you STEAM friend request.

By grooves I meant that the copper tubings aren't arranged/stuck together. It's like Tubing-Base-Tubing-Base-Tubing-Base-Tubing-Base, so filled the TP between the tubings so that the one applied on the processor spreads evenly between both the surfaces (and is not wasted filling in the tubing-base areas).

Steam-Steam ! :cheers:

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Thanks. :)

 

By grooves I meant that the copper tubings aren't arranged/stuck together. It's like Tubing-Base-Tubing-Base-Tubing-Base-Tubing-Base, so filled the TP between the tubings so that the one applied on the processor spreads evenly between both the surfaces (and is not wasted filling in the tubing-base areas).

Steam-Steam ! :cheers:

 

Yes, I will show you the base of the Hyper 212+, it will be similar if not exactly the same.

 

dc8bb4d0_cooler-master_hyper-212-plus_ba

 

The gap might be lesser between individual pipes but the purpose is served, right. Cheers!

 

I had a Hyper 212+ that is why stating so.

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