The Playstation 5 thread

[kmkaks]

2 minutes ago, quixote_1989 said:

 

 

 

 

You win 11/10. Congratulations. Art right there.

Edited October 14, 2020 by kmkaks

[l33tmaniac]

1 hour ago, AnK said:

You need to decide what you want to compare 

 

the comparison in discussion was about hardware design of comparable tech packed inside of it 

 

not about the tech itself 

 

That doesn't even make sense. These guys are not PC builders where they pick up components available in the market and build something. How can you compare hardware design of comparable tech when the two MNCs don't necessarily make comparable tech. At least until recently, that is. 

[hope]

16 minutes ago, sobbii said:

And your humour is on par with my 5 year old..


Sent from my SM-N960F using Tapatalk
 

ah congrats man

[Right]

14 hours ago, playstationdude said:

 

Most disturbing part of this gif is you can hear it in your head. <splat> <splat>

[triggr happy ss]

[PhantomShade]

6 minutes ago, triggr happy ss said:

 

Hope this is true.

PS360 console gen had games for 7-8 years since release.

[triggr happy ss]

Just now, AnK said:

If this comes out to be true then I’ll once & for all agree that Sony is following M$ in the lying & cheating department

Well they did make this statement

 

“not coming to other consoles for a limited time. Also coming to PC”

 

Later changed the statement

With Jim Lyan handling the ship anything is possible ,that guy means business . 

[Walker]

Lol if true run for the hills. We may just have to see some nanga naach 

[kmkaks]

 

Boy oh Boy

[CarbonCore]

PS5 to use "liquid metal" for preparedness, the real aim is to cut costs
The head of mechanical and thermal design talks about PS5 disassembly (Part 1)

 

https://xtech.nikkei.com/atcl/nxt/column/18/00001/04707/

 

"I really wanted to use liquid metal as a heat conductor. It took a lot of determination and preparation. Sony Interactive Entertainment's (SIE) PlayStation 5 (PS5) console is scheduled to launch in November 2020, and Yasuhiro Otori, who is responsible for the mechanical and thermal design of the console, has been working on the PS5 This is how he describes his thoughts on the technology that played a key role in making the He has been involved in the design of the PlayStation since the PS2, and appeared himself in the PS5 disassembly video released by SIE on October 7, 2020, to work and explain the process.

　PS5 uses liquid metal as the heat conduction material (TIM) for transferring heat from the main processor (SoC) to the heat sink. Without this liquid metal TIM, the PS5 would have been larger, more expensive, and the cooling fan would have been louder. The noise of the cooling fan during gaming varies depending on the situation, but according to Otori, "the PS5 is generally quieter than the PS4".

　The PS5 is available in two models, one with an optical disc drive and the other without, priced at US$499 and US$399, respectively, which is a bargain against the specifications. The thermal design contributed greatly to the cost savings in achieving this price. This article will be divided into two parts, Part 1 and Part 2, based on the interview with Mr. Otori.

Why did we use liquid metal in TIM?
　Preparations for the adoption of liquid metal TIM began about two years ago, when the configuration and shape of the PS5 hardware was roughly decided. In addition to the design, we began to consider various aspects of the adoption of liquid metal TIM, from the manufacturing process to procurement. They decided to use liquid metal TIM because the main processor (SoC) had a high operating frequency, but the die was small and the thermal density was "very high" (Mr. Otori). The heat density of the SoC, especially during gaming, is "much higher" (he said) than the PS4. That's because the PS5's SoC "basically runs at almost full power during gaming" (he says). As a result, TDP (Thermal Design Power) values and the amount of heat generated during gaming are "about the same". On the other hand, it is rare for a PS4 SoC to operate at the very edge of TDP, and even when gaming, it generates only a few percent of its TDP.

The reason for the small size of the SoC die is that die size is directly related to cost and yield. In other words, the smaller the die size, the lower the cost and the more difficult it is for defects to enter the die, which leads to higher yields.

Liquid metal TIM is more expensive than conventional thermal conductors such as thermal grease. However, when considering the thermal design of electronic devices, the more effort is put into cooling close to the heat source, the "better the cost performance" (Mr. Otori). This is because if heat can be recovered efficiently near the heat source, there is no need to spend money on heat sinks and cooling fans. On the other hand, if thermal grease is used, an expensive heat sink with high cooling performance is required.

　In other words, even if we use liquid metal TIM, which leads to higher costs, we can reduce the total cost of cooling as a result," says Otori. The speed of the cooling fan can also be reduced, which reduces noise. In other words, the use of liquid metal TIM "makes sense in terms of cost and quietness" (Mr. Otori).

　So will liquid metal TIM be used in other electronic devices in the future? As for that, "I don't know" (Mr. Otori), but he prefaced it by saying, "As an engineer, the less expensive a device is, the more I want to use it" (Mr. Otori). He believes that liquid metal TIM will be a powerful tool in cases where heat sinks are expensive and in need of help.

Teaming up with a material manufacturer and know-how in application
　Liquid metal TIM has many advantages, but it is a material that "poses a challenge to use" (Mr. Otori). For example, because it is conductive, if liquid metal TIM leaks onto the board, there is a risk of a short circuit in the board. In addition, it is highly reactive to aluminum, so it must be kept away from aluminum.

Because of these issues, although TIM is used in mobile phone base stations and other devices, its use in consumer applications is limited to a limited number of notebook computers and "overclockers," which are enthusiasts who increase the operating frequency of processors. .

　Therefore, the company has taken measures to address these issues so that it can be used in game consoles that are mass-produced in quantities ranging from several million units to more than 10 million units per year. For example, a sealed structure was adopted to prevent leakage of the liquid metal TIM. This structure is patented, although it would be obvious if it were to be disassembled and seen. Above all, there is a lot of manufacturing know-how, such as how to apply and automate liquid metal TIM, that is not obvious just by looking at it," said Otori. For example, liquid metal TIM is applied by an automated machine, but "it's a different method than conventional grease," according to Mr. Otori. We cooperated with material manufacturers to realize this liquid metal TIM. The company claims to have added customizations based on existing products.

 

Crazy stuff. The "last minute overclock" brigade is finally dead.
 

[hsk_colossus]

 
Boy oh Boy

This is going to stir the pot[emoji3]


Sent from my iPhone using Tapatalk

[rushab oswal]

32 minutes ago, CarbonCore said:

PS5 to use "liquid metal" for preparedness, the real aim is to cut costs
The head of mechanical and thermal design talks about PS5 disassembly (Part 1)

 

https://xtech.nikkei.com/atcl/nxt/column/18/00001/04707/

 

 

 

 

Crazy stuff. The "last minute overclock" brigade is finally dead.
 

In short batao is it good or bad for lifespan of the product?

[Snake]

32 minutes ago, CarbonCore said:

PS5 to use "liquid metal" for preparedness, the real aim is to cut costs
The head of mechanical and thermal design talks about PS5 disassembly (Part 1)

 

https://xtech.nikkei.com/atcl/nxt/column/18/00001/04707/

 

 

 

 

Crazy stuff. The "last minute overclock" brigade is finally dead.
 

 

Dont worry, they'll come up with something else

[rushab oswal]

1 hour ago, triggr happy ss said:

Only the soundtrack

[WhatsInTheName]

Does the (horizontal/vertical) orientation of the chip affect the efficiency of LM? 

[CarbonCore]

37 minutes ago, rushaboswal said:

In short batao is it good or bad for lifespan of the product?

 

Runs cooler and quieter with a large fan, its only gonna improve the lifespan. Funny how going with LM actually saved them money with tradition heatsink and only one fan instead of two.

[ZooZoo]

1 hour ago, kmkaks said:

 

Boy oh Boy

Their bias is straight up visible. They are not even trying to hide it. I was surprised they were able to review a Sony product while continuing to blow MS. They are just salty that Sony didn't gave them special treatment and send a console to review and thus throwing a tantrum. 

[dylanjosh]

1 hour ago, kmkaks said:

 

 

 

 

 

Fantastic video. Points out the all the good stuff but also the drawbacks of such a design. But ofcourse people will call it biased because they didn't sing praises and praises. 

[CarbonCore]

46 minutes ago, WhatsInTheName said:

Does the (horizontal/vertical) orientation of the chip affect the efficiency of LM? 

 

Its not in the free flow state despite what the name says. It is still a paste, just less viscous so orientation will not affect thermals.

[triggr happy ss]

So 2 out of 3 people from DF are bias now ,only john is left .  I give him a week more

Edited October 14, 2020 by triggr happy ss